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微蝕劑 SBT-203

一、 產品簡介
I. Product Introduction

SBT-203作為H2SO4—H2O2體系穩定劑對蝕刻穩定效果良好,該蝕刻體系能均勻微蝕銅層表面,適用于孔金屬化、圖形電鍍及鍍金、鍍鎳前處理過程,另外還可用于掛具退銅。
As the stabilizing agent of H2SO4—H2O2system, SBT-203 has good stabilizing effect to etching. This etching system can evenly micro etch the copper layer surface. It can be used in the process before pore metalizing, pattern and gold plating, nickel plating as well as the copper stripping of hangers.

二、裝置
II. Devices
載體/工具
Carrier/tool
材質要求
Material requirements
槽體材質
Material of tank body
硬質聚乙烯、聚丙烯
Rigid polyethylene, polypropylene

三、100升工作液配制
III.Preparation of 100 liters’ working solution
品名
Product Name
范圍
Scope
軟化水
De-mineralized water
約78升
About 78 liters
濃硫酸(98%)
Concentrated sulfuric acid(98%)
8升
8 liters
SBT-203 3升
3 liters
過氧化氫(30%)
Hydrogen peroxide (30%)
化學鍍銅
Electro-less copper plating
8升
8 liters
  圖形鍍
Graphic plated copper
4升
4liters

四、工藝條件及控制指標
IV.Technical Conditions and Control Indicators
組份/參數
Components/parameters
最佳值/工作范圍/要求
Optimal value/working scope/requirement
工作溫度
Working temperature
20-40℃
處理時間    化學鍍銅
Processing time  Electro-less copper plating
2-3分鐘
2-3 minutes
圖形銅
Graphiccopper
0.5-1分鐘
0.5-1 minutes
H2O2 >6%
H2SO4 >8%
Cu2+ <80g/L

五、槽液維護
V.Maintenance of Solution

1. 每處理200Ft2補加濃硫酸0.5升,雙氧水2升工作液,同時加入0.5升SBT-203(M101按雙氧水補加量的20%補加),補加前應先舀出適量體積的工作液。
1. Add additional 0.5 liter of concentrated sulfuric acid, 2 liters of hydrogen peroxide working solution for each 200Ft2, meanwhile, add 0.5 liter of SBT-203(M101 added as per 20% of the additional hydrogen peroxide amount). Before additional adding, scoop out the right volume of the working solution.
2. 溶銅銅達80克/升工作液后需更換部分或全部槽液。
2. When the amount of dissolved copper comes up to 80 g / l liter’s working solution, part or all of the tank solution needs to be replaced.

六、分析方法
VI.Analysis Methods

試樣準備:取10.0ml粗化液于100ml的容量瓶中,加D.I水至刻度
Sampling preparation: put 10.0ml coarsening solution into a 100ml volumetric flask and then add D.I water to the scale.
硫酸
Sulphuric acid
1.吸取上述稀釋液20.0ml于250ml錐形瓶中,
1. Draw the above 20.0ml diluents from a 250ml conical flask,
2. 加100ml D.I.水,攪勻,加5滴甲基橙指示劑,
2. Add 100ml D.I. water, mix well and then add 5 drops of methyl orange indicator,
3.用0.1N NaOH滴定從紅色到終點桔黃色,
3. 0.1N NaOH is used to titrate to orange from red,
計算: H2SO4 %(體積比)=13.3*(0.1N× NaOH消耗ml )
Calculation: H2SO4 %(volume ratio)=13.3*(0.1N× NaOH consumption ml )

雙氧水
Hydrogen peroxide

1. 吸取稀釋液20.0ml 250ml錐形瓶中,加100ml D.I.水,攪均,
1. Draw 20.0ml diluents from a 250ml conical flask, add 100ml D.I. water, and then mix well
2. 加40ml 20% H2SO4攪均,
2. Add 40ml 20% H2SO4, and mix well.
3. 用0.1N的KMnO4標準液滴定至粉紅色,
3. 0.1N KMnO4 standard solution is titrate to pink,
計算: H2O2 %(體積比)=12.9×0.1×(標準KMnO4消耗ml )
Calculation:H2O2 %(volume ratio)=12.9×0.1×(Standard KMnO4 consumption ml )

銅含量
Cu content

1. 吸取稀釋液5.0ml于250ml錐形瓶中,加D.I水50ml,
1. Draw 5.0ml diluents from a 250ml conical flask, add 50ml D.I. water, and mix well
2. 加10ml 1:1的氨水,10ml的甲醇,3滴PAN指示劑,攪動,
2. Add 10ml 1:1 ammonia, 10ml methanol and 3 drops PAN indicator, and then mix them well
3. 用標準0.10M EDTA滴定,直到顏色變成淡綠色,
3. Standard 0.10M EDTA is used to titrate until it becomes pale green,

計算: [Cu2+] g/L=(M.VEDTA)×63.54
Calculation: [Cu2+] g/L=(M.VEDTA)×63.54


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